This is our GENERAL capability for your quick reference. You are always welcomed to check with us for any strict tolerance which is not shown here.

All our manufacturing processes designed to make the board which can fulfill the quality requirements stated in IPC-A-600G Class II, IPC6012 Class II, Perfag 2E and Perfag 3C.

		No. of Layers Available		1 - 24
		Min. Line Width		0.10mm
		Min. Line Spacing		0.10mm
		Min. Annual Ring	PTH	0.15mm
			Non-PTH	0.20mm
		Min. Hole Size	PTH	0.25mm
			Non-PTH	0.30mm
		Hole Aspect Ratio		8:1
		Min. Board Thickness	Single & Double Sided	0.3mm
			Multilayer (4, 6, 8, 10)	0.4mm, 1.0mm, 1.2mm, 1.5mm
		Max. Board Size		450mm x 600mm
		Solder Mask Pitch		0.1mm
		Hole Tolerance	PTH	+/- 0.076mm
			Non-PTH	+/- 0.05mm
		Hole Position Tolerance		+/- 0.076mm
		Outline Tolerance	Routing	+/- 0.15mm
			Punching	+/- 0.15mm
		Thickness Tolerance		MIL-P-13949 Class 2
		Thickness Tolerance	Depth	+/- 0.15mm
			Position	+/- 0.15mm
		Gold Finger		5μ" - 50μ"